ACCEPTED PRESENTATIONS
View the accepted presentations for the 2025 SMTA International Technical Conference! Dive into the hottest trends, cutting-edge technology, and innovative solutions revolutionizing today's electronic manufacturing and assembly landscape.
Additional presentations will be added to the track lists below as they are accepted into the technical program.
Full program schedule and presentation listings coming soon.
​Additively Manufactured Electronics (AME) Track
Advances in additive process – methods, recipes, materials, assembly, and reliability
Robust Printed Interconnects for Harsh Environments
Presenter: Riadh Al-Haidari, Ph.D., Binghamton University
Co-Authors: Mark Poliks, Abdullah Obeidat, Erik Busse, Mousa Al-Zanina, Mohammed Alhendi, Firas Alshatnawi, Binghamton University
​
Screen-Printed VIA-Enhanced Circuits on Flexible Substrates: Optimization and Reliability Evaluation
Presenter: Riadh Al-Haidari, Ph.D., Binghamton University
Co-Authors: Babatunde Falola, Olya Noruz Shamsian, Udara Somarathna, Cameron Cretaro, Mohammed Alhendi, Mark Poliks, Binghamton University; Gurvinder Singh Khinda, Nancy Stoffel, GE HealthCare; Rafael Tudela, Tapecon Inc
​
Additive Copper Plating for Selective Metallization of Conformal Electronics
Presenter: Maya Chiesa, Lockheed Martin
​
Advancing Circuits on Glass: Multilayer Stacking and Image-Guided Verification using Additively Manufactured Electronics (AME)
Presenter: Kenneth Church, Ph.D., nScrypt
Co-Authors: Bryce Gray, Sam LeBlanc, Lance Sookdeo, Jason Benoit, nScrypt
​
Aerosol Jet Printing for Hybrid Electronics Packaging
Presenter: Michael Renn, Optomec
Co-Author: Livio Gamba, Optomec Inc
​
A Bi-Free In-Containing Lower Temperature Solder with Superior Drop-Shock Resistance and Electromigration Resistance
Presenter: Hongwen Zhang, Indium Corporation
Co-Authors: Danyang Zheng, Huaguang Wang, Indium Corporation
Advanced Packaging (APT) Track
Advances in 1st level packaging and assembly
A Novel Flux-Less Solder Paste Reflowed Under Formic Acid for Surface Mounting Technology
Presenter: Lily Bai, Indium Corporation
​
Novel Integration Concepts for Power Electronics – Embedding of SiC MOSFET for High-Performance Power Modules
Presenter: Lars Boettcher, Fraunhofer IZM Berlin
Co-Authors: Andreas Ostmann, Thomas Löher, David Schütze, Manuel Seckel, Fraunhofer IZM Berlin
​
Sintering Cu Paste as Via Filling Materials for Through Glass Via (TGV)
Presenter: Yoshinori Eijiri, Resonac Co., Ltd.
Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Masayoshi Nishimoto, Hiroshi Uragami, Resonac Co., Ltd.
​
Considerations for Thermo-Mechanical Reliability Simulations of Advanced Packages
Presenter: Tyler Ferris, Ansys, Inc.
​
A Single-Step Process for Die-Attach and Substrate-Attach Using Pressure-Assisted Silver Sintering Paste, Designed to Withstand Harsh Operating Conditions
Presenter: Anne-Marie Laugt, Inventec Performance Chemicals
Co-Authors: Dr. Maël Boland, Mélanie Mathon, Inventec Performance Chemicals; Battist Rabay, Ph.D., Adrian Stelzer, Ph.D., Julien Hossain, Nano-join GmbH
​
How to Model Solder Wettability by Using Artificial Intelligence
Presenter: Yu-Chen Liu, National Cheng Kung University​​
​
The Future of Electronics Packaging Is Chiplet Architecture
Presenter: Charles Woychik, Ph.D., NHanced Semiconductors
​
Influence of Reflow Temperature on the Mechanical Strength of a Lower-Temperature Solder Pastes Across Various Surface Finishes
Presenter: Dangyang Zheng, Indium Corporation
Co-Authors: Liam Evans, Cassandra Goppert, Mengyao Wen, Huaguang Wang, Ph.D., Francis Mutuku, Ph.D., Hongwen Zhang, Ph.D., Indium Corporation
Low Temperature Solder (LTS) Track
Developments that can enable reflow soldering below 200°C
The Effect of Homologous Temperature on the Thermal Cycling Performance and Failure Mode of a Bismuth-Tin Low Temperature Solder Alloy
Presenter: Richard Coyle, Nokia Bell Labs
Co-Author: iNEMI Group
​
Supercooled Solder Pastes for Low-Temperature Electronics Manufacturing
Presenter: Radhika Jadhav, Indium Corporation
Co-Authors: Yifan Wu, Ph.D., Ian Tevis, Ph.D., Indium Corporation
​
Solder Joint Reliability of Middle P% and High P% Ni/Au With Low Melting Point Solder Containing Indium
Presenter: Mutsumi Komeyama, C.Uyemura & Co., Ltd.
Co-Authors: Toma Sasaki, Fuminori Shibayama, Katsuhisa Tanabe, Shigeo Hashimoto, C.Uyemura & Co., Ltd.
​
Enabling Assembly Reliability and Extending Processability While Significantly Lowering COâ‚‚ Footprint and Energy Consumption Using Low Temperature Solder
Presenter: Chris Klok, MacDermid Alpha Electronics Solutions
Co-Authors: Ebad Rehman, Claudio Travi, MacDermid Alpha Electronics Solutions
​
Vibration Performance of Low-Temperature Tin-Bismuth Based Solders
Presenter: Michael Osterman, University of Maryland-CALCE-EPSC
Co-Authors: Jonathan Martin, Abhijit Dasgupta, CALCE/University of Maryland
​
SAC-In Low Temperature Soldering
Presenter: Alexander Russell, Indium Corporation
Co-Authors: Joseph Hertline, Ryan Mayberry, Indium Corporation
​
Establishing Regions on a Current Density vs Temperature Plot for Bismuth Migration and Segregation Within Sn-Bi Solder Joints, Based on a Review of Literature Studies
Presenter: Lavanya Ashok Swamination, Intel Corporation
​
Exploring the Feasibility and Challenges of a Low-Temperature Alloy in Wave Soldering Applications
Presenter: Gayle Towell, AIM Solder
Co-Author: Dave Hillman, Hillman EAS LLC
​
Investigation of Compatibility and Thermal Reliability in Low Temperature Soldering for Ball Grid Array Components With NiAu Surface Finish
Presenter: Watson Tseng, Shenmao Technology Inc.
Co-Authors: Chunyu Chang, Tzu-Chi Chia, Coti Chung, Keith Lee, Ken Lin, Shenmao Technology Inc.
​
Effect of Copper Content on Interfacial Reaction of In-Containing Lead-Free Solder Joints Across Different Surface Finishes
Presenter: Huaguang Wang, Indium Corporation
​
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly With Lower Temperature Soldering Phase I: Processing Optimization
Presenter: Hongwen Zhang, Indium Corporation
Co-Authors: Francis Mutuku, Huaguang Wang, Indium Corporation
​
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly With Lower Temperature Soldering Phase II: TCT Reliability
Presenter: Hongwen Zhang, Indium Corporation
Co-Authors: Danyang Zheng, Huaguang Wang, Francis Mutuku, Indium Corporation
​Manufacturing for Excellence (MFX) Track
Current project work in manufacturing process areas
SMT Process Assembly Improvements for Defect Mitigation in BTCs – Bottom Terminated Components
Presenter: Norman Armendariz, RTX / Raytheon Technologies​
​
Electronic Assembly Wash Chemistry Effectiveness as a Function of Soil Loading
Presenter: Mike Bixenman, Ph.D., Magnalytix, LLC
Co-Author: Vladimir Sitko, PBT-Works
​
Component Failure Resulting From Over-Exposure to Ionizing Radiation During Manual X-Ray Solder Joint Inspection
Presenter: Michael Brinkley, Axiom Electronics LLC
​
An Exciting New Technology for SMT Manufacturing
Presenter: Keith Bryant, KB Consulting
​
Powder Characteristics' Influence on Lead-Free Solder Pastes' Rheological Behavior for Use in Jet Printing
Presenter: Mathilde Buret, Performance
Co-Author: Marjorie Leveneur, Mélanie Mathon, Inventec Performance Chemicals
​
Improving Transfer of Thermal Energy During Selective Soldering Using Common Settings and Preparation/Tooling Choices
Presenter: Joseph Clure, KurtzERSA Inc.
Co-Authors: David Miller, KurtzERSA Inc.; Thomas Shoaf, Plexus Neenah Operations
​
A Methodology and Associated Tool Set for Electronic Componentry Management in OEM Product Design
Presenter: Robert Cremins, IBM Corporation
Co-Authors: Feng Xue, Curtis Grosskopf, Eric SR Ng, John Drummond, Yvonne Chii Yeo, IBM Corporation
​
Increasing Life-Cycle and Resiliency of Electronics
Presenter: Rick Fung, NanoFlowX
Co-Authors: Evan Vickers, Ph.D., Rick Fung, NanoFlowX
​
Hyper BGA Package Assembly: Experimental Design and Process Development
Presenter: Sunil Gopakumar, Meta
Co-Author: Rui Yang, Greg Wang, Joan Wu, Meta
​
Application of New Ultra-Low Residue Solder Paste for System-in-Package
Presenter: Leo Hu, Indium Corporation
Co-Authors: Jonas Sigfrid Sjoberg, Xinfang Liu, Jinjin Bai, Fiona Chen, Indium Corporation
​
Development and Evaluation of a Solder Paste With a New Flux Coagulation Technology
Presenter: Shantanu Joshi, Koki Solder America Inc.
Co-Author: Jasbir Bath, Koki Solder America Inc.
​
Development and Evaluation of a New Solder Paste for the Formic Acid Reduction Reflow Oven Process
Presenter: Shantanu Joshi, Koki Solder America Inc.
Co-Author: Jasbir Bath, Koki Solder America Inc.
​
Examining the Correlation Between SIR Testing and ROSE Analysis in Cleanliness Qualification Procedures
Presenter: Adam Klett, Ph.D., KYZEN Corporation
Co-Author: Zach Papiez, Magnalytix, LLC
​
A Study of the Impact of Incomplete Drying of Electronic Assemblies on Cleanliness and Reliability
Presenter: Adam Klett, Ph.D., KYZEN Corporation
Co-Author: James Perigen, KYZEN Corporation
​
Enhancing Intelligent Manufacturing Through Repair Wait Time Estimation Using Deep Learning Models
Presenter: Sai Srikanth Reddy Kolli, Binghamton University – WISE
Co-Authors: Daryl Santos, Binghamton University – WISE; Edward Wong, Foxconn Industrial Internet (FII)
​
Spray Pattern Considerations for Cleaning Densely Populated Assemblies With Low Standoff Components
Presenter: Michael Konrad, Aqueous Technologies
​
Fill the Void VIII: Can Reflow Profiles Really Improve Voiding in Solder Joints?
Presenter: Tony Lentz, FCT Assembly
​
Build to Print or Build to Reality?
Presenter: Elias Malfavon, Metal Etch Services, Inc.
​
Reducing Cost Through DFX: A Deep Dive Into PCB Design and Fabrication Economics
Presenter: Michael Marshall, NCAB Group USA
​
Development of a Heatmap Inspection System to Identify Potential Warpage-Induced Defects
Presenter: Aksh Patel, Binghamton University
​
Between Solder Bead and Product Recall – The Quality Problem Identification in Electronics Manufacturing by FT-IR Spectroscopy
Presenter: Viktoria Rawinski, Rawinski GmbH​
​
Industry Leading Applications of AI Agents in Electronics Manufacturing
Presenter: Andrew Scheuermann, Arch Systems
Co-Authors: Tim Burke, Cameron Sobie, Arch Systems; Michal Wierzchowski, Christa Kerlin, Jabil
​
Progression of AI Agents vs. Human Experts in Electronics Manufacturing Root Cause Analysis (RCA) and Guided Actions
Presenter: Andrew Scheuermann, Ph.D., Arch Systems
Co-Authors: Tim Burke, Gadi MeikCristobal Zatarain, Shahar Reem, Cameron Sobie, Arch Systems
​
Comparison of Stencil Capabilities for Fine Feature Printing
Presenter: Chrys Shea, Shea Engineering Services
Co-Authors: Antonio Torres, Michael Butler, PARMI
​
The Development of SIR Glass Test Boards to Qualify and Monitor the Electronic Assembly Process
Presenter: Vladimir Sitko, PBT-Works
Co-Author: Mike Bixenman, Magnalytix, LLC
​
Vapor Deposited Stencil Nano-Coatings – A New Break Thru or Just Another Coating? Part 2
Presenter: Greg Smith, Stentech
​
Potential of Power Scaling for Laser Depaneling and Its Influence on Temperature Behavior of the FR4 Substrate
Presenter: Patrick Stockbrügger, LPKF Laser & Electronics SE
Co-Author: Jake Benz, LPKF Laser & Electronics North America
​
Void Mitigation for Exposed Pad of D2PAK Component
Tushar Tike, Indium Corporation
​
Enhancing Efficiency in SMT Partial Reel Storage: A User Experience With Smart Racks
Presenter: Greg Vance, Rockwell Automation
Co-Author: Morgan Britton, Rockwell Automation
​
iNEMI Board Assembly Material Technology Roadmap of 2024 and 10 Years Beyond
Presenter: Paul Wang, MiTAC Computer Technology
Co-Author: Jasbir Bath, Bath Consultancy LLC
​
Adiabatic & Isothermal Humidification for Electronics Manufacturing: The Science of Humidity Control in Manufacturing
Presenter: Richard Williams, Carel USA
Reliability and Harsh Environments (RHE) Track
Reliability testing materials and technologies for developers & users
Thermal Fatigue Reliability of Multiple Sized Resistors With Characterized Voiding Levels
Presenter: Colette Anctil, Collins Aerospace
Co-Authors: Tim Pearson, Ross Wilcoxon, Collins Aerospace
​
Automating Solder Fatigue Predictions in Electronic Components From Raw Time-Temperature Data With Dwell Time Effects
Presenter: Michael Bak, Ph.D., Ansys, Inc.
Co-Author: Josh Akman, Ansys, Inc.
​
Board Level Reliability Testing of RF Packages Using Flexible Substrate
Presenter: Mumtaz Bora, pSemi
​
Challenges of Void Measurement
Presenter: Keith Bryant, KB Consultancy
​
The Effect of Dwell Time on Thermal Cycling Performance of High Reliability Solder Alloys With a 55/125 °C Test Profile
Presenter: Richard Coyle, Nokia Bell Labs
Co-Authors: See abstract for full listing
​
Microstructure Evolution in Sn-Ag-Cu-Bi Solder Joints in Harsh Accelerated Thermal Cycling
Presenter: Chris Gourlay, Imperial College London
Co-Authors: Chen-Lin Hsieh, Imperial College London; Richard J. Coyle, Nokia Bell Labs
​
Investigation Into Void Evaluation, Reliability Impact, and Establishment Criteria for Various BTCs
Presenter: Ben Gumpert, Lockheed Martin
​
Using the Pb-Free Solder Reflow Process as a Tin Whisker Risk Mitigation Protocol: A Statistical Assessment
Presenter: Dave Hillman, Hillman EAS LLC
Co-Authors: Ross Wilcoxon, Tim Pearson, Collins Aerospace
​
Solder Joint Voids and Reliability: A Practical Approach
Presenter: Dave Hillman, Hillman EAS LLC
Co-Author: Richard Coyle, Nokia
​
Condensation Control and Damage Prevention on Circuit Boards
Presenter: Dan Jenkins, Steel Camel
Co-Authors: Bob Lowry, Terry Munson, Foresite, Inc.
​
Effect of Salt Contaminations on Creep Corrosion of Printed Circuit Boards
Presenter: Donghyun Kim, Nokia
Co-Author: Chen Xu, Nokia
​
Tin Whiskers 101: 2025
Presenter: Ron Lasky, Indium Corporation
​
Innovative Material Reinforcement Strategies for Advanced Packaging Solutions in Automotive Electronics
Presenter: Anna Lifton, MacDermid Alpha Electronics Solutions
Co-Authors: Kennedy Fox, Paul Salerno, Ebad Rehman, MacDermid Alpha Electronics Solutions
​
Sinusoidal Vibration Testing of High-Reliability Mixed BGA Solder Joints
Presenter: Jayse McLeran, John Deere Intelligent Solutions Group
​
Optimizing Mixed Alloy Solder Pastes for Low Voiding and High PCB Reliability
Presenter: Thuy Nguyen, Indium Corporation
Co-Authors: Hongwen Zhang, Ph.D., Ronald C. Lasky, Ph.D., Adam Murling, Indium Corporation
​
Board Factors for Testing Solder Interconnects Under Vibration
Presenter: Michael Osterman, University of Maryland–CALCE–EPSC
Co-Authors: Olatunji Idowu, Silvestro Randall, Bharamgonda Aniket, Dasgupta Abhijit, CALCE/UMD
​
Thermo-Mechanical Reliability Prediction of BGAs Using Reduced Order Model
Presenter: Arvind Purushotaman, ANSYS Inc.
C-Authors: Natalie Raines, Josh Akman, Nathan Blattau, Ansys Inc.
​
Suggestions and Recommendations in Documenting Solder Joint Performance Testing (Less Is Not Always More)
Presenter: Anthony Rafanelli, Ph.D., Engineering Consultant
​
Protecting Electronics With Next Generation UV Curing Conformal Coatings
Presenter: Cole Sandvold, MacDermid Alpha Electronic Solutions
Co-Authors: Bethany Turner, Saskia Hogan, Phil Kinner, Christopher Allen, Andi Duffy, Anna Lifton, MacDermid Alpha Electronics Solutions
​
Surviving the Extremes: High Performance Electronics
Presenter: Chintan Sanghani, SLB
​
Towards Electronics Reliability Intelligence
Presenter: Reinhardt Seidel, DEEPTRONICS GmbH
​
Gold Embrittlement in SAC Solder
Presenter: Julie Silk, Keysight Technologies
​
Simulation of Solder Joint Stress in VIPPO Solder Pads
Presenter: David Spitz, Ansys, Inc.
Co-Author: Jon Kordell, Ph.D., Ansys
​
In Situ Observation of Failure in Pb-Free Solder Joints in Tensile Strain
Presenter: Keith Sweatman, Nihon Superior Co., Ltd.
Co-Author: Xin F. Tan, Stuart D. McDonald, Kazuhiro Nogita, University of Queensland
​
Designing for Reliability: Cu-Free Solder Alloys in Demanding Environments
Presenter: Alberrt Wu, National Central University
Co-Authors: Wei-Ting Lin, National Central University; Kelvin Li, Ken Lin, Shenmao Technology Inc.
Test and Inspection (INS) Track
Ensuring product reliability short & long-term
Advancements in Industrial Computed Tomography: Innovative CT Trajectories for High-Resolution Imaging
Presenter: Vineeth Bastin, Comet Technologies USA Inc
Co-Author: David Kruidhof, Comet Technologies USA Inc
​
Bounding-Box Acoustic Localization and Partial-Projection X-Ray Validation for Wafer Bonding Defects
Presenter: Patrick Craig, University of Florida
Co-Authors: Antika Roy, Shajib Ghosh, Liton Kumar Biswas, Md Shah Imran Shovon, Navid Asadizanjani, University of Florida
​
Challenges of X-Ray Inspection for Generative AI Circuit Boards
Presenter: Nick Fieldhouse, Omron Inspection Systems
​
Testing Methods for Electronic Assembly Verification
Presenter: David Levine, TEXMAC Inc
​
Enhancing X-Ray Inspection in Advanced Packaging: A New Source
Presenter: Chris Nicholson, Ph.D., Comet Technologies USA
Co-Author: Anthony Williams, Comet X-Ray
​
Development of Chlorinated Corrosion Testing (CCT) for Diverse Data Center Environments
Presenter: Kwangwon Seo, Ph.D., Samsung Electronics
​
Left-Shifted Test Planning, Structural Coverage Review, and Value Stream Map–Driven Capacity Management for Supply Chain Resilience
Presenter: Zhipeng Wang, IBM Corporation