PROFESSIONAL DEVELOPMENT COURSES (PDCs)
Half day educational courses are led by internationally respected professionals with extensive experience in the subject area. Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Professional Development Courses are application oriented and structured to combine field experience with scientific research to solve everyday problems. All courses are scheduled as LIVE, in-person classes.
PDC1: Cost Breakdown and Analysis of Microelectronics Packaging Technologies
Sunday, October 20 | 1:30pm-5:00pm
Instructor: Amy Lujan, SavanSys Solutions LLC
Course Details
This PDC will present process flows and analyze the cost drivers of mature and advanced packaging technologies. Activity-based cost modeling will be used, and this course will explain why and how cost modeling is useful. The technologies covered are wire bond, flip chip, wafer-level packaging (fan-in and fan-out), and interposer-based packaging (also called 2.5D). Each packaging technology will be introduced, process flow(s) will be presented in step-by- step detail, and cost drivers will be highlighted. Cost drivers are design parameters that have a notable impact on the final package cost. All types of direct cost will be covered, including labor, material, capital, tooling, and yield; indirect costs will be explained as well. Case studies will be provided for each packaging technology.
PDC4: Failure Analysis of Electronic Devices
Sunday, October 20 | 1:30pm-5:00pm
Instructor: Martine Simard-Normandin, Ph.D., MuAnalysis
Course Details
The supply chain of electronic devices is large and complex. It comprises designers, component suppliers, board manufacturers and assembly providers. When something goes wrong, the failure mechanism is not always obvious. It is the role of the Failure Analysis team to establish the link between the failure mode and the failure mechanism. Once that link is understood, the path to the solution and the responsible party for it becomes clear. In this workshop, we will review the tools of failure analysis, explaining each technique and what information it provides. Concrete examples will be used.
PDC5: Fundamentals of Thermal Interface Materials
Sunday, October 20 | 1:30pm-5:00pm
Instructor: Rita Mohanty, Ph.D., Henkel Corporation
Course Details
The cooling of electronics is critical to the safety, performance, and reliability of contemporary electronic systems. Electronics industries continue to move towards highly integrated devices with smaller feature sizes and higher currents with smaller footprint devices. Higher functionality comes with the price of high heat generation due to higher power dissipation. In general, heat from a system can be removed by conduction, convection and radiation. For most electronic applications, heat is primarily removed by transferring heat by conduction and natural convection through a solid medium. Polymer base Thermal Interface Material (TIM) is one of the most effecting media used in thermal management today. In this course, we will discuss some common types of TIM used in TIM 2 and TIM 1.5 applications. Value associated with each type of TIM and their common applications will be discussed here.
PDC6: Intermetallic Compounds (IMCs) Basic Metallurgy and Impact on Product
Monday, October 21 | 8:30am-12:00pm
Instructor: David Hillman, Hillman Electronic Assembly Solutions LLC
Course Details
Intermetallic compounds (IMCs) or intermediate phases are formed between two or more metallic elements in many metal alloy systems. During soldering, an IMC is formed at the soldered interface as the molten solder reacts with an element in the substrate. IMCs also can form within the bulk solder as the joint solidifies. IMCs have critical roles in the solder joint quality and reliability. Ductility is an important solder joint property, and the low intrinsic ductility of IMCs is associated with brittle behavior and reliability risk in product service. This workshop reviews the IMCs associated with both SnPb and Pbfree soldering processes. Basic metallurgy of the IMC phases with case studies and their influences on solder joint reliability are covered. Special emphasis on the IMC phases found in the new Generation 3 Pbfree solder alloys and their potential impact of solder joint reliability.
PDC8: SMT Process Engineering - Advanced Topics for Experienced Engineers and Technical Leaders
Monday, October 21 | 8:30am-12:00pm
Instructor: Chrys Shea, Shea Engineering Services
Course Details
This advanced course is designed for process engineers and technical leaders who want to learn how to improve the productivity of their SMT lines. Emphasis is on the relationships among different process variables, how to characterize them, and how to maximize yields and throughputs. The course begins with an overview of quality attributes and how to apply workmanship standards to achieve acceptable conditions while minimizing rework. It then details each SMT process on a typical assembly line, including automated inspection, and discusses how each can factor into process indicators or unacceptable outputs. After reviewing the processing factors that influence defects, process control methods are introduced. Discussions then focus on designed experiments to identify the main drivers of quality output, and line balancing for optimizing throughput. The technical discussions turn to business discussions - of financial considerations, the cost of defects, capital equipment justifications and data-driven evaluation methods for assembly machines and materials. Equipment evaluation, characterization, and process control are emphasized in the final portion of the course.
PDC9: Artificial Intelligence – Opportunities, Challenges & Possibilities
Monday, October 21 | 8:30am-12:00pm
Instructor: Jennie Hwang, Ph.D., H-Technologies Group
Course Details
As moving into Artificial Intelligence (AI) era, the proliferation of new AI tools and platforms is remaking our daily lives and every aspect of workplace including research, engineering, design, manufacturing, and management across all industries from semiconductor and printed circuit board design to life sciences and new material innovation. Even not being an
AI technologist, staying in the core knowledge zone is a viable strategy to remain proficient and competitive in the workplace. In light of the transformative potential of AI technologies, this short course offers a holistic overview and panoramic views of AI, systematically and hierarchically, with the goal to spur innovative ideas and inspire new vistas to capitalize the sound benefits of AI and maximize on-job efficiency and effectiveness, as well as enterprise growth. The course highlights what it takes to achieve AI with justified confidence and will map out AI landscape including manifold perspectives on the current and future of AI development and deployment. There are no required prerequisites; join us in this defining moment of AI and stay in core knowledge zone!
PDC10: Assembly: Best Practices for Improving Manufacturing Productivity
Monday, October 21 | 8:30am-12:00pm
Instructors: Phil Zarrow, Jim Hall, ITM Consulting
Course Details
You have the responsibility and resources to improve the productivity of an assembly operation....what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line
engineers involved in manufacturing, design and quality engineering.
PDC11: Master Class on Ultra HDI PCB Technology: Innovations in Materials and Methods
Tuesday, October 22 | 8:30am-12:00pm
Instructor: Michael Vinson, Electroninks
Course Details
This master class proposal is tailored to explore the pivotal role of materials and methods in the advancement of Ultra High-Density Interconnect (HDI) PCB technology. With a focus on innovation and optimization, the class aims to provide participants with a deep understanding of the latest materials, techniques, and methodologies driving the evolution of Ultra HDI PCBs. The class will begin with an in-depth look at advanced materials utilized in Ultra HDI PCB fabrication. Participants will be introduced to cutting-edge substrate materials, including high-performance resin systems, low-loss dielectrics, and thermally conductive substrates, enabling enhanced signal integrity, thermal management, and reliability in ultra-high-density designs. Participants will gain insights into material selection criteria, compatibility considerations, and performance evaluation methodologies essential for achieving optimal results in Ultra HDI PCBs.