PROFESSIONAL DEVELOPMENT COURSES (PDCs)
Half day educational courses are led by internationally respected professionals with extensive experience in the subject area. Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Professional Development Courses are application oriented and structured to combine field experience with scientific research to solve everyday problems. All courses are scheduled as LIVE, in-person classes.
PDC4: Failure Analysis of Electronic Devices
Sunday, October 20 | 1:30pm-5:00pm
Instructor: Martine Simard-Normandin, Ph.D., MuAnalysis
Course Details
The supply chain of electronic devices is large and complex. It comprises designers, component suppliers, board manufacturers and assembly providers. When something goes wrong, the failure mechanism is not always obvious. It is the role of the Failure Analysis team to establish the link between the failure mode and the failure mechanism. Once that link is understood, the path to the solution and the responsible party for it becomes clear. In this workshop, we will review the tools of failure analysis, explaining each technique and what information it provides. Concrete examples will be used.
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PDC6: Intermetallic Compounds (IMCs) Basic Metallurgy and Impact on Product
Monday, October 21 | 8:30am-12:00pm
Instructor: David Hillman, Hillman Electronic Assembly Solutions LLC
Course Details
Intermetallic compounds (IMCs) or intermediate phases are formed between two or more metallic elements in many metal alloy systems. During soldering, an IMC is formed at the soldered interface as the molten solder reacts with an element in the substrate. IMCs also can form within the bulk solder as the joint solidifies. IMCs have critical roles in the solder joint quality and reliability. Ductility is an important solder joint property, and the low intrinsic ductility of IMCs is associated with brittle behavior and reliability risk in product service. This workshop reviews the IMCs associated with both SnPb and Pbfree soldering processes. Basic metallurgy of the IMC phases with case studies and their influences on solder joint reliability are covered. Special emphasis on the IMC phases found in the new Generation 3 Pbfree solder alloys and their potential impact of solder joint reliability.
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PDC8: SMT Process Engineering - Advanced Topics for Experienced Engineers and Technical Leaders
Monday, October 21 | 8:30am-12:00pm
Instructor: Chrys Shea, Shea Engineering Services
Course Details
This advanced course is designed for process engineers and technical leaders who want to learn how to improve the productivity of their SMT lines. Emphasis is on the relationships among different process variables, how to characterize them, and how to maximize yields and throughputs. The course begins with an overview of quality attributes and how to apply workmanship standards to achieve acceptable conditions while minimizing rework. It then details each SMT process on a typical assembly line, including automated inspection, and discusses how each can factor into process indicators or unacceptable outputs. After reviewing the processing factors that influence defects, process control methods are introduced. Discussions then focus on designed experiments to identify the main drivers of quality output, and line balancing for optimizing throughput. The technical discussions turn to business discussions - of financial considerations, the cost of defects, capital equipment justifications and data-driven evaluation methods for assembly machines and materials. Equipment evaluation, characterization, and process control are emphasized in the final portion of the course.
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PDC9: Artificial Intelligence – Opportunities, Challenges & Possibilities
Monday, October 21 | 8:30am-12:00pm
Instructor: Jennie Hwang, Ph.D., H-Technologies Group
Course Details
​As moving into Artificial Intelligence (AI) era, the proliferation of new AI tools and platforms is remaking our daily lives and every aspect of workplace including research, engineering, design, manufacturing, and management across all industries from semiconductor and printed circuit board design to life sciences and new material innovation. Even not being an
AI technologist, staying in the core knowledge zone is a viable strategy to remain proficient and competitive in the workplace. In light of the transformative potential of AI technologies, this short course offers a holistic overview and panoramic views of AI, systematically and hierarchically, with the goal to spur innovative ideas and inspire new vistas to capitalize the sound benefits of AI and maximize on-job efficiency and effectiveness, as well as enterprise growth. The course highlights what it takes to achieve AI with justified confidence and will map out AI landscape including manifold perspectives on the current and future of AI development and deployment. There are no required prerequisites; join us in this defining moment of AI and stay in core knowledge zone!
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PDC10: Assembly: Best Practices for Improving Manufacturing Productivity
Monday, October 21 | 8:30am-12:00pm
Instructors: Phil Zarrow, Jim Hall, ITM Consulting
Course Details
You have the responsibility and resources to improve the productivity of an assembly operation....what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line
engineers involved in manufacturing, design and quality engineering.
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PDC11: Master Class on Ultra HDI PCB Technology: Innovations in Materials and Methods
Tuesday, October 22 | 8:30am-12:00pm
Instructor: Michael Vinson, Electroninks
Course Details
This master class proposal is tailored to explore the pivotal role of materials and methods in the advancement of Ultra High-Density Interconnect (HDI) PCB technology. With a focus on innovation and optimization, the class aims to provide participants with a deep understanding of the latest materials, techniques, and methodologies driving the evolution of Ultra HDI PCBs. The class will begin with an in-depth look at advanced materials utilized in Ultra HDI PCB fabrication. Participants will be introduced to cutting-edge substrate materials, including high-performance resin systems, low-loss dielectrics, and thermally conductive substrates, enabling enhanced signal integrity, thermal management, and reliability in ultra-high-density designs. Participants will gain insights into material selection criteria, compatibility considerations, and performance evaluation methodologies essential for achieving optimal results in Ultra HDI PCBs.
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