ENGAGE, EDUCATE, INSPIRE, ADVANCE
CONFERENCE TECHNICAL TRACKS
Advanced Packaging (APT) Track
Advances in 1st level packaging and assembly
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Innovations in package materials, structures and assembly processes
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Advances in CSP, FCBGA, FCCSP, bumping, 2.5/3D, SiP, PoP, PiP, in homogeneous and other novel integrations
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Component and board level reliability of electronic packaging and other components
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Unique application environments and challenging mission profiles
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Materials improvements or innovations to address reliability or hazardous substance restrictions
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First and second level interconnect, including Cu wire, Ag wire, Copper Pillar, lead finishes, wettable flanks, novel alloys
Additively Manufactured Electronics (AME) Track
Advances in additive process – methods, recipes, materials, assembly, and reliability
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Additive Processes
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Process Design and Control
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Conductive and Dielectric Inks
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Sintering Methods
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Thinned Chips
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Assembly of Additive Fabricated Circuits
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Reliability of Additive FHE
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Applications of Additive FHE
Low Temperature Solder (LTS) Track
Developments that can enable reflow soldering below 200°C
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Alloy development for interconnects addressing low temperature applications, including reliability study results
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Microstructural characterization and structure/property relationships of low temperature materials
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Process development for manufacturing using low temperature solder
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Participants represent individual companies, industry consortia and working groups, universities, and research institutes. Participant business interests include low-cost consumer electronics, telecom, high-end computing equipment.
Manufacturing for Excellence (MFX) Track
Current project work in manufacturing process areas
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Miniaturization & Cavity board assembly
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Odd form factor
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Increased interconnect density
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DFX for next generation products
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Cleaning and conformal coating challenges and solutions
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Automation and Control (e.g. Industry 4.0, Smart Manufacturing, Supply Chain)
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Factory Integration & Industry 4.0
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Lean Six Sigma case studies
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Interesting Failure Analysis and Root Cause Corrective actions
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All aspects of the SMT process (i.e. Screen Printing, Pick and Place, Reflow & Inspection
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The MFX sessions aim to bring together expert input and detailed case analysis as well as experiments dedicated to highlight problems and solutions of today and the future.
Reliability and Harsh Environments (RHE) Track
Reliability testing materials and technologies for developers & users
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Alloy and material development for interconnects, addressing high performance and high-value applications.
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Thermal and mechanical solder joint reliability including thermal cycling, thermal shock, vibration, drop/shock, and bending and interconnect failure modes.
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Materials Selection and Test Methods for high performance and reliability
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Microstructural characterization, and structure/property relationships.
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Predictive modeling.
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Soldering, Sintering, Laser reflow, and unique joining challenges for high performance requirements.
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Ruggedization practices for harsh environment applications.
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Electronic Component Lifecycle Management, including Prognostic and Health Management (PHM) of electronic systems.
Test and Inspection (INS) Track
Ensuring product reliability short & long-term
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Metrology
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Component Test Methodologies
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Component Inspection Methodologies
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Board Test Methodologies
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Board Inspection Methodologies
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Reliability Assessment Methods
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Short-term and Long-term Reliability Testing Methods
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Test Data Collection, Aggregation, Interpretation, and Use for Manufacturing Effectiveness and Excellence, Including Industry 4.0 Applications
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System-Level and Custom Test Methodologies
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Failure Analysis and Root Cause Identification Techniques
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Test Plan Creation, Implementation, and Comparative Risk Analysis of Differing Test Methodologies
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Test Troubleshooting
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Test Completeness
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Reliability
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Counterfeit Mitigation Techniques
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Case Studies
Women's Leadership Program (WLP) Track
Promote diversity in engineering fields
An inclusive culture in the workforce increases organization's efficiency and creates a competitive advantage. Join us for the Women's Leadership Program at SMTA International, which aims to promote diversity in engineering fields and a culture of inclusion for women in technical conferences.