Free to all attendees!
Wednesday, October 23 - Thursday, October 24
Show Floor - UHDI Pavilion Booth #2753

Join us at the first-of-its-kind Ultra HDI Pavilion, where industry leaders will converge to explore the cutting-edge advancements in Ultra-High Density Interconnect (UHDI) technology. Explore a comprehensive schedule packed with technical sessions covering everything from The SMTA Ultra-HDI Test Board design to fabrication materials, assembly processes, and strategies to address continued miniaturization. A highlight you can't miss is the "Lab to Fab" working session, designed to break down silos and foster collaboration across the supply chain, accelerating the transition from concept to production. Whether you're looking to stay ahead of the curve or shape the future of miniaturization, the Ultra HDI Pavilion is where you need to be.

 

Wednesday, October 23

10:00-10:20: Chrys Shea, Shea Engineering, "UHDI Test Board Design and Reasoning"
10:30-11:15: Oren Manor, Siemens, "DFM: Fab and Assembly"
11:30-11:50: Paul Cooke, AGC, "Fabrication Materials for UHDI"
12:00-12:20: John Johnson, ASC, "Fabrication Processes for UHDI"
12:30-12:50: Greg Smith, Blue Ring, "Stencil"
1:00-1:20: Gayle Towell, Aim Solder, "Materials (Ultra Fine Powders)"
1:30-1:50: Brent Fischthal, Koh Young America, “Inspection”
2:00-2:20: Guest Speaker, “Component Placement”
2:30-2:50: Bill Capen, Honeywell FM&T, "Cleaning and SIR"
3:00-4:00: Elliott Fowler, Sandia National Laboratories; Bill Capen, Honeywell FM&T; Chrys Shea, Shea Engineering, "Lab to Fab - Working Session"

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Thursday, October 24

10:00-10:30: Paul Cooke, AGC, "Additive Fabrication Options: What’s the big deal?"
11:00-11:30: John Johnson, ASC, "It depends PCB Design Trade Off's"
11:30-1:00: Networking

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